LSI Logic Introduces G90(TM) Next Generation System-on-a-Chip Product

New 90-Nanometer Product to Extend SoC Offerings to LSI Logic's Customers in the Global Communications, Consumer and Storage Markets

MILPITAS, Calif., April 15 /PRNewswire-FirstCall/ -- LSI Logic Corporation (NYSE: LSI - news) today introduced its G90(TM) product, a next generation system-on-a-chip (SoC) capability, creating new possibilities for customers requiring accelerated time-to-market with increased integration and system-level functionality.

"LSI Logic is focused on our customers' time to market requirements," said Rick Marz, LSI Logic executive vice president of Communications and ASIC Technology. "The unique value LSI Logic brings to its customer base is supplying the complete SoC solution. Design projects at the 90nm node are very complex and, through the capabilities of the G90 product, LSI Logic ensures that our market leading customers are able to differentiate their product offerings in the global marketplace."

LSI Logic continues to strategically focus its R&D resources on value-added technology capabilities. The G90 product is built upon a process platform jointly defined by LSI Logic and Taiwan Semiconductor Manufacturing Corporation (TSMC). The new process technology platform is a natural extension of the relationship formed between LSI Logic and TSMC on the 130-nanometer joint development process (JDP) announced last year.

The G90 product is compatible with TSMC's 90nm process design rules. With the foundation of a common set of design rules in place, customers will be able to integrate a broader spectrum of reusable cores, resulting in faster time to market with Right-First-Time On Time(TM) results.

"The real challenge in the ASIC and SoC space has become the delivery and use of the complete product," said Dr. Handel Jones, International Business Strategies, Inc. chairman and CEO. "Utilizing an industry-aligned process, LSI Logic's G90 platform efficiently integrates internally and externally developed reusable intellectual property cores into the LSI Logic design suite. As a result, LSI Logic is able to enhance its technology strengths as an integrator of reusable intellectual property building blocks into next generation system-on-a-chip designs."

The complete G90 solution, which includes intellectual property, libraries, design tools, memories, advanced packaging and I/Os, can be designed on the 90nm platform using the LSI Logic FlexStream® design environment.

Customer engagements with the G90 product will commence this summer with the release of the design libraries. Designs employing the G90 product will be initially manufactured at TSMC fabrication facilities, commencing in 2003, and at LSI Logic's world-class manufacturing facilities at a later date.

About LSI Logic Corporation

LSI Logic Corporation is a leading designer and manufacturer of communications, consumer and storage semiconductors for applications that access, interconnect and store data, voice and video. In addition, the company supplies storage network solutions for the enterprise. LSI Logic is headquartered at 1551 McCarthy Boulevard, Milpitas, CA 95035, 866-574-5741 (within U.S.), 408-954-3108 (outside U.S.), http://www.lsilogic.com .

    Notes to Editor:
    1. All LSI Logic news releases (financial, acquisitions, manufacturing,
       products, technology etc.) are issued exclusively by PR Newswire and
       are immediately thereafter posted on the company's external website,
       http://www.lsilogic.com .
    2. The LSI Logic logo design, FlexStream, Right-First-Time On Time and G90
       are trademarks or registered trademarks of LSI Logic Corporation.
    3. All other brand or product names may be trademarks or registered
       trademarks of their respective companies.
    4. Please do not assign a Reader Service number to this release.